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Provide PWB photonic bonding technology services
Optical wire bonding technology (Photonic Wire Bonding, referred to as PWB) is mainly used to realize the optical interconnection between different optical chips and optical waveguide devices. Its basic concept is similar to the common metal wire connection (Metallic wire bonding) in circuit chips, except that the "wire" that plays the role of connection is no longer metal, but optical waveguide, and the conduction is no longer electrical signal but optical signal. The main application scenarios of PWB technology include: optical connection of heterogeneous material elements such as lasers and silicon optical chips, laser arrays and modulator arrays, and laser arrays and passive wave-splitting elements. The basic idea of PWB manufacturing is shown in Figure 1. By controlling the high-energy pulse beam, multi-photon polymerization occurs at a specific position of the photoresist, and a 3-dimensional polymer waveguide is formed. The size of the polymer waveguide is designed according to the mode field Diameter (MFD) of the optical chip, and then the optical field is transmitted from chip A to chip B. This process not only avoids high-precision passive or active positioning of photonic elements relative to each other, but also allows the fabrication of arbitrary three-dimensional interconnected waveguide geometries, improving the mode field matching between photonic line waveguides and planar integrated waveguides. The optical connection scheme using the PWB avoids the time-consuming alignment adjustment in the traditional optical coupling mode, saves the lens and other materials required for beam shaping, and is not limited by the diameter of the optical fiber, the preparation is simple and fast, and is conducive to the realization of automated production.
The Division has a preliminary PWB optical processing capacity. The equipment is Sonata 1000 PWB processing equipment and Reprise Tool 1000 development and optical cladding processing equipment of German Vanguard Company (Figure 2), which can realize various PWB leads such as laser array-PLC waveguide array, laser array-fiber array (FA), PLC waveguide array-fiber array and on-chip optical connection (OCB) (Figure 3), the minimum insertion loss of the tested PWB connection is <2dB(OCB), and the insertion loss deviation of the array is 1~2dB(80 channels, OCB).
Figure 2,PWB processing equipment: Sonata 1000 (left) and Reprise Tool 1000 (right)
Fig. 3, photo of processed PWB connection,(a)LD and PWB connection of slab waveguide device; (B) LD and PWB connection of single mode fiber;(c) PWB connection of slab waveguide and single mode fiber array;(d) PWB connection between silicon optical waveguide array.
Fig. 4, the insertion loss test result of PWB connected to silicon optical waveguide, the number of channels of the tested device is more than 80, and Sonata 1000 is used to automatically complete all PWB processing at one time. in the figure (a) is the PWB insertion loss test result of all channels, and (B) is the statistical result of insertion loss deviation of all channels.